Saturday, December 07, 2019

2007 PDF Archives



Vol. 6 No. 1

Design of X-Band High Power Cascade Amplifier—Yeap Yean Wei, Tan Soon Hie and Goh Cher Hiang

Inverse Modeling Estimation Algorithm for Multi-Carrier High Power Amplifiers—Mohamed K. Nezami

Tutorial: Statistical Analysis of Microwave Circuits Predicts Real World Performance—Anurag Bhargava

Editorial: Predictions for an Engineer's Job During 2007—Gary Breed

Technology Report: Visions for 4G: Many Ways to Achieve Integrated Wireless Connectivity

Design Notes: A Few Notes on Batteries


Vol. 6 No. 2

Spatially Selective Antenna for Very Close Proximity HF RFID Applications—Boris Y. Tsirline

Base Station Receiver Design Using a Direct-Conversion I/Q Demodulator—James Wong, Min Zou, Doug Stuetzle and Sunny Hsiao

A Design Tool for Improving the Input Match of Low Noise Amplifiers—Dale D. Henkes

Tutorial: Basic Principles of Electrically Small Antennas—Gary Breed

Editorial: You Can Help Develop the Next Generation of Engineers—Gary Breed

Technology Report: WiFi Networks Gain Ground While WiMAX Gets Ready

Design Notes: Updated Web Site Features an Improved Parametric Search Tool


MARCH 2007
Vol. 6 No. 3

Spatially Selective Antenna for Very Close Proximity HF RFID Applications—Part 2 —Boris Y. Tsirline

Material Science Paves the Way to Smaller High Frequency Inductors—Taiyo Yuden, Inc. Engineering Staff

Designing Resistive Unequal Power Dividers—Greg Adams

Tutorial: Wireless Ad Hoc Networks: Basic Concepts—Gary Breed

Editorial: Lots of Great Products are Available for Today's Engineers—Gary Breed

Technology Report: Metamaterials Allow Manipulation of EM Waves from Low Frequencies to Light

Design Notes: Trigonometry and Circuits


APRIL 2007
Vol. 6 No. 4

Microstrip Design in a Silicon Technology using Closed Form Analytical Expressions—Ain Rehman

An Overview of Microwave Sensor Technology—Jiri Polivka

Miniature Direction-Finding Antenna Array—Joseph R. Jahoda

Tutorial: Using Today's Test Equipment: Suggestions for New Engineers—Gary Breed

Editorial: Classic Design, Implemented with New Materials—Gary Breed

Technology Report: Sensors and Sensor Networks Mix Old and New Technologies

Design Notes: Reader Feedback and More



MAY 2007
Vol. 6 No. 5

RF SiP Design Verification Flow with Quadruple LO Down Converter SiP—HeeSoo Lee and Dean Nicholson

CAD Analysis of Microstrip Lines Using Micromachining Techniques—Kamaljeet Singh and Surendra Pal

Simulating and Designing an RF Transmitter for Small Satellites—Mohamed Kameche

Understanding Base Biasing Influence on the Large Signal Behavior in HBTs—Byoungyong Lee and Larry Dunleavy

Tutorial: A Tutorial Introduction to Optical Modulation Techniques—Gary Breed

Editorial: The Internet—Using Its Power, Avoiding Its Chaos—Gary Breed

Technology Report: News of Recent Research Activities

Design Notes: A Book Review, Plus Notes on Electromagnetics


JUNE 2007
Vol. 6 No. 6

High Efficiency, High Linearity GaN HEMT Amplifiers for WiMAX Applications—U.H. Andre, E.J. Crescenzi, R.S. Pengelly, A.R. Prejs, & S.M. Wood

Circuit Extraction Techniques Provide Faster Interconnect Modeling and Analysis—Dr. Michael Heimlich

Tutorial: Modern Coaxial Cables Emphasize Precision and High Reliability—Gary Breed

Editorial: There's Nothing Magic about 50 Ohms—Gary Breed

Technology Report: MIMO and Related Diversity Techniques Improve Wireless Range and Reliability

Design Notes: Some Notes on Noise


JULY 2007
Vol. 6 No. 7

Software Defined Radio Architecture for NASA's Space Communications—M.C. Scardelletti, R.C. Reinhard, M. Andro, D.J. Mortensen, T. Kacpura, C. Smith, J. Liebetreu, & A. Farrington

Characterizing Intermodulation Distortion of High-Power Devices—M. Ibrahim Khalil

Advanced Characterization of Non-Uniform Passive Devices—Dr. Hatem Akel

Tutorial: Some Design Guidelines for Electromagnetic Compatibility—Gary Breed

Editorial: On the Importance of Electromagnetic Compatibility—Gary Breed

Technology Report: Software and Materials Support Antenna Design and Manufacturing

Design Notes: Notes on Switching Mixers


Vol. 6 No. 8

Load Transient Response of a DC/DC Converter in GSM/EDGE Handset Applications—Chirs W. Liu

Active Multiplier Realization Using Harmonic Loading at Ku-Band—K. Singh, R. Ramsubramanian, S. Pal, & D. Bhatnager

Bringing New Power and Precision to Gated Spectrum Measurements—Tom Wright, Joe Gorin, & Ben Zarlingo

"Get it Right the First Time" When Specifying Filters—Sam Benzacar & Joseph Pillari

Tutorial: Things to Consider in the Transition to Chip-Level Design—Gary Breed

Editorial: Where do the Politicians Stand on Technology Issues?—Gary Breed

Technology Report: High Power Developments Emphasize Semiconductor Materials

Design Notes: Why 50 Ohms? The Readers Respond!


Vol. 6 No. 9

Effective Use of Ceramic Capacitor Tuning Sticks for Impedance Matching—Saroj K. Patro, Yatin Buch, & Ravi B. Kishore

UHF RFID Antennas for Printer-Encoders - Part 1: System Requirements—Boris Y. Tsirline

Microwave Transitor Modeling for Time Domain Simulation—Firas Mohammed Ali

Tutorial:Classic Designs for Lumped Element and Transmission Line 90-Degree Couplers—Gary Breed

Editorial: The Most Universal Components: Cables and Connectors—Gary Breed

Technology Report: Advanced Manufacturing Relies on Flexible and Accurate Text Equipment

Design Notes: Notes on Cable Equalizers


Vol. 6 No. 10

Practical Design Comparison Between High-Power GaAs MESFET and GaN HEMT—Ivan Boshnakov

UHF RFID Antennas for Printer-Encoders - Part 2: Antenna Types—Boris Y. Tsirline

Designing a Cost-Effective In-Situ Digital Power Measurement System—Dave Distler

Tutorial: Fields and Waves—Visualizing Important Electromagnetic Concepts—Gary Breed

Editorial: Coping with a Rapidly-Growing 'Knowledge Gap'—Gary Breed

Technology Report: Nanopower Electronics Provide Wireless Links Without Using Batteries

Design Notes: Using IC Logarithmic Power Detectors


Vol. 6 No. 11

New Design Techniques Enable Low Cost RF Power Amplifiers—Bob Todd and Bobby McDonald

UHF RFID Antennas for Printer-Encoders - Part 3: Mobile Equipment—Boris Y. Tsirline

A Broadband High-Isolation Electronic Switch Covers 30 kHz to 22 GHz—Alexander Chenakin

Tutorial: RF Signal Conditioning for Analog-to-Digital Conversion—Gary Breed

Editorial: Accurate Technical Language is Not Always Easy—Gary Breed

Technology Report: Test and Measurement Technologies Address Both Operation and Performance

Design Notes: High Q Capacitors for Impedance Matching


Vol. 6 No. 12

Power Combiners, Impedance Transformers and Directional Couplers—Andrei Grebennikov

Tutorial: Quartz Crystal Basics: From Raw Materials to Oscillators—Ken Hennessey

Editorial: There's Little Evidence of Convergence in 4G wireless—Gary Breed

Technology Report: An Update on 4G Wireless: Identifying the Capabilities Required in a 4G Handset

Design Notes: DIN 7-16 Connectors; Useful LCR Circuits and Formulas


November 2019

1911 HFE cover

The November 2019 Online Edition is now available for viewing and download!

Download November HFE PDF



Web Exclusives


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3D Glass mmWave PDK

A new 3D Glass Solutions (3DGS) glass-based mmWave RF device PDK for use with NI AWR software has been released and is available directly from 3DGS. The PDK enables designers to develop passive components such as filters and amplifier impedance-matching circuits critical for 5G FR2 communications, automotive radar, and other mmWave applications.

A Designer’s Primer on 5G Communications

Recent advances in NI AWR software are helping designers develop the antenna and RF front-end components that are making 5G a reality. This primer offers content on the innovative wizards and synthesis technologies that enable engineers designing 5G communications systems to deliver cost-effective, high performance, and high-reliability products to market.

Insulated Wire Inc.

Insulated Wire Inc. is pleased to announce that following the retirement of a French delegate, IW Microwave Products Division President, John Morelli, has been appointed as the Secretary for IEC/SC46F, a subcommittee of IEC/TC46. IEC/SC46F is responsible for RF and Microwave Connectors and Components International Standardization.

Mr. Morelli, who is sponsored by Insulated Wire, brings significant RF/Microwave connector and component experience to the position, and we congratulate him on his new appointment. Mr. Morelli had been serving as the chief Technical Advisor for the US National Committee’s Technical Advisory Group to IEC/SC46F.

The US National Committee of the IEC is a fully integrated entity of the American National Standards Institute (ANSI).

Coming Events

IMS 2019, Boston, June 2 - 7, 2019

IEEE EMC + SIPI, New Orleans, July 22 - 26, 2019

IEEE AUTOTESTCON, National Harbor, MD, September 9 – 12, 2019

EuMW 2019, Paris, September 29 - October 4, 2019

MILCOM 2019, location TBD, October 2019 (date TBD)

AOC, Washington, DC, October 28 - 30, 2019

IEEE Radio and Wireless Symposium, location TBD, January 2020 (date TBD)