Qorvo® to Create State-of-the-Art Semiconductor Packaging Center

Qorvo® has been selected by the U.S. government to create a State-of-the-Art (SOTA) Heterogeneous Integrated Packaging (SHIP) RF production and prototyping center. The SHIP program will ensure that microelectronics packaging expertise and leadership is available for both U.S. defense contractors and commercial clients that require design, validation, assembly, test and manufacturing of next-generation RF components.

The exclusive SHIP Other Transaction Agreement (OTA), worth up to $75 million, was awarded to Qorvo by the Naval Surface Warfare Center (NSWC), Crane Division. This program is funded by the Office of the Undersecretary of Defense for Research and Engineering’s (OUSD R&E) Trusted and Assured Microelectronics Program (T&AM), and is administered by the Strategic & Spectrum Missions Advanced Resilient Trusted System (S²MARTS) Other Transaction Agreement (OTA), managed by National Security Technology Accelerator (NSTXL).

Under the SHIP program, Qorvo will design and deliver the highest levels of heterogeneous packaging integration. This is essential to meet the size, weight, power and cost (SWAP-C) requirements for next-generation phased array radar systems, unmanned vehicles, electronic warfare platforms and satellite communications.

eBook: A Designer’s Primer on Radar Systems

Combined with advances in phased-array antennas and integration technologies, radars are moving beyond military/aerospace markets to address a host of commercial applications. This primer showcases how NI AWR software provides designers with the advanced modeling and simulation technologies needed to meet the challenges of all types of radar system design.

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A Designer’s Primer on 5G Communications

Recent advances in NI AWR software are helping designers develop the antenna and RF front-end components that are making 5G a reality. This primer offers content on the innovative wizards and synthesis technologies that enable engineers designing 5G communications systems to deliver cost-effective, high performance, and high-reliability products to market.

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