Articles
Parent Category: 2014 New Products
IC Packaging
Quik-Pak, a division of Delphon, provides IC Packaging and Assembly services. The company specializes in a variety of services that together provide a full turn-key solution including wafer preparation, die attach, wire bonding, remolding and marking/branding. Custom assembly services are also offered for Flip Chip, Ceramic Packages, Chip-on-Board, Stacked Die and MEMS.
Quick-Pak
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